PCB Assembly Express is an electronic contract manufacturer located in Tualatin, Oregon. Like most contract manufactures in the USA, we specialize in quick-turn prototype and small volume printed circuit board assembly. We offer consignment, full turnkey and partial turnkey assembly services. If you would like to provide the bare boards and all the parts (board level components) please refer to Consignment Services for more information. If you would like us to take care of sourcing the PCBs and parts please refer to Full and Partial Turnkey Services for more information.
Our state-of-the-art facility uses the latest SMT and Through Hole Equipment to manufacture quality and reliable products in a timely fashion.
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SMT, Through-hole & Mixed Technology Single & Double Sided SMT Assembly |
PCBA Testing Services |
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Leaded & Lead Free (RoHS) Assembly No-Clean & Water Soluble Fluxes Standard Flux: Water Soluble |
Conformal Coating |
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SMT Sizes: 0201 or greater BGA Pitch: 16 mil (0.4mm) or greater Fine Pitch: 16 mil (0.4mm) or greater |
Rework Services |
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Ball Grid Array (BGA & µBGA), QFN, POP & lead-less chips |
Wire & Cable Harnesses |
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Class II and Class III Inspection Visual, Automatic Optical & X-ray Inspection |
Box Build |
The three main types of printed circuit boards are rigid, flex and rigid-flex. Rigid boards are usually made with FR4 material but they can also be fabricated with Rogers, Aluminum or other materials.
| • Rigid |
| • Flex |
| • Rigid Flex |
In general it is always better to panelize your boards particularly when they are small. If your board length or width is less than 2 inches they must be panelized or we will require a fixture.
| • Minimum Size: inches |
| • Maximum Size: inches |
| • Minimum Thickness: |
| • Maximum Thickness: |
The surface finish protects the copper circuitry from
corrosion and provides a solderable surface for your
components.
ENIG, Immersion Silver and Immersion Tin are
recommended for fine pitch components including µBGAs.
| • Hot Air Solder Leveling ( HASL) |
| • Lead-free HASL |
| • Electroless Nickel Immersion Gold (ENIG) |
| • Immersion Silver |
| • Immersion Tin |
Due to a growing concern for the public health and the environment in 2006 the European Union prohibited the further use of lead in electronics also known as Restriction of Hazardous Substances in electrical and electronic equipment (RoHS). In the United States there is no law prohibiting the use of leaded solder in electronics however, many manufacturers require the use of lead free solder on their electronic devices.
| • Leaded |
| • Lead-free/ROHS compliant |
SMT components come in a variety of standardized packages including 1206, 0805, 0603, 0403, 0201, SOT, SOIC, QFP, BGA, etc. Surface mount packages are designed so that they could be easily manipulated on pick and place machines.
| • SMT Size: 0201 or lager |
| • Fine Pitch: 16 mil (.4 mm) or greater |
| • BGA Pitch: 16 mil (.4 mm) or greater |
| • BGA Ball Count: Up to 1932 |
Most vendors offer the same components in a wide variety of packages to accommodate different pick-and-place loading requirements. The most common options are: cut tape, reel, tube, and tray. Each packaging type has its benefits. We prefer to receive components in a tape (cut tape, partial reel or full reel).
| • Cut Tape (6 inches or longer) |
| • Partial Reel |
| • Full Reel |
| • Tube (preferred a whole tube) |
| • Tray |
Every board is visually inspected after SMT and Through-hole. Every leadless components is X-rayed. All boards go through AOI and a final QC inspection.
| • Class II & Class III |
| • Visual |
| • X-ray (leadless components) |
| • Automatic Optical Inspection (AOI) |
Improving board testing will reduce your development time and manufacturing cost.
| • In-circuit Testing |
| • Functional Testing |
